会议日期
2024.05.28 - 2024.05.31
地点
美国 丹佛市
投稿截止
2024.03.04
邮箱
general-chair@ ieee-itherm.net
电话
2024 年第 23 届 IEEE 电子系统热与热机械现象学会议 (ITherm)
会议时间:2024.5.28-2024.5.31
会议地点:科罗拉多州丹佛市盖洛德落基山脉度假酒店及会议中心
会议官网: https://www.ieee-itherm.net/
会议委员会
LEADERSHIP TEAM
General Chair
Ahish Gupta
Intel Corporation
Program Chair
Amy Marconnet
Purdue University
Vice Program Chair
Milnes David
IBM Corporation
Communication Chair
Jack Maddox
University of Kentucky
COMPONENT-LEVEL THERMAL MANAGEMENT
Track Chair
Luca Amalfi
SEGUENTE, Inc.
Track Co-Chair
Stephanie Allard
IBM Corporation
Track Co-Chair
Prabhakar Subrahmanyam
Intel Corporation
Track Co-Chair
Darin Sharar
Army Research Labs
SYSTEM-LEVEL THERMAL MANAGEMENT
Track Chair
Amir Shooshtari
University of Maryland
Track Co-Chair
Patrick Shamberger
Texas A&M University
Track Co-Chair
Sanjoy Saha
Intel Corporation
Track Co-Chair
Shadi Mahjoob
California State University, Northridge
MECHANICS AND RELIABILITY
Track Chair
David Huitnik
University of Arkansas
Track Co-Chair
Paul Paret
NREL
Track Co-Chair
Lang Yuan
EMERGING TECHNOLOGIES AND FUNDAMENTALS
Track Chair
Jimil Shah
TMG Core
Track Co-Chair
Sukwon Choi
Penn State
Track Co-Chair
Weihua Tang
Track Co-Chair
Saket Karajgikar
Meta
SPECIAL TECHNICAL CONTRIBUTIONS
Panel Chair
Victor Chiriac
Global Technology Cooling Group
Panel Co-Chair
Kimberly Saviers
Raytheon Technologies
Research Center
Panel Co-Chair
Vaibhav Bahadur (VB)
UT Austin
Tech Talk Chair
Naveenan Thiagarajan
GE
Tech Talk Co-Chair
Georges Pavlidis
University of Connecticut
Tech Talk Co-Chair
Qian Han
Student Poster Chair
Arjang Shahriari
Student Poster Co-Chair
Joseph Hanson
Intel
Student Poster Co-Chair
Aakrati Jain
IBM
Research Workshop Chair
Patrick Shamberger
Texas A&M University
Research Workshop Co-Chair
Sreekant Narumanchi
NREL
Research Workshop Co-Chair
Satish Kumar
Heat Sink Competition Co-Chair
Joe Alexandersen
University of Southern Denmark
Heat Sink Competition Co-Chair
Sameer Rao
University of Utah
Heat Sink Competition Co-Chair
Amy Marconnet
Purdue University
Heat Sink Competition Co-Chair
Naveenan Thiagarajan
GE
Heat Sink Competition Co-Chair
Ronald Warzoha
US Naval Academy
Heat Sink Competition Co-Chair
Jack Maddox
University of Kentucky
Keynotes Chair
John Thome
EPFL
Keynotes Co-Chair
Justin Weibel
Purdue University
NSF Interaction Chair
Mahsa Ebrahim
Loyola Marymount University
ITherm/ECTC Diversity Panel Representative
Cristina Amon
University of Toronto
PDC Chair
Jeffrey Suhling
Auburn University
PDC Co-Chair
Kitty Pearsall
IBM (Retired)
ADMINISTRATIVE
Finance Chair
Pritish Parida
IBM Corporation
Finance Co-Chair
Gargi Kailkhura
Lunar Energy
Operations Chair
Yuanchen Hu
IBM Corporation
Operations Co-Chair
Pardeep Shahi
Nvidia
SPONSORS AND EXHIBITORS
Sponsorship and Exhibitor Co-Chair
Mehdi Asheghi
Stanford University
Sponsorship and Exhibitor Co-Chair
Chandra Mohan (CM) Jha
Microsoft
Sponsorship and Exhibitor Co-Chair
Ronald Warzoha
US Naval Academy
COMMUNICATION
Conference Proceedings
Paul Wesling
Consultant
Social Media
Chirag Kharangate
Case Western Reserve University
Branding and Graphic Design
Jack Maddox
University of Kentucky
AWARDS
Richard Chu Award Chair
Sushil Bhavnani
Auburn University
Richard Chu Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Richard Chu Award Co-Chair
Yogendra K. Joshi
Georgia Institute of Technology
Best Paper Award Chair
Yogendra K. Joshi
Georgia Institute of Technology
Best Paper Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Best Paper Award Co-Chair
Jeffery Suhling
Auburn University
联系我们
Ashish Gupta 博士,总主席,general-chair@ ieee-itherm.net
Amy Marconnet 教授,项目主席,program -chair @ieee-itherm.net
Milnes P. David 博士,副主席项目主席,viceprogram-chair@ieee -itherm.net
John F. Maddox 教授,通讯主席,communications@ieee-itherm.net
2024 年第 23 届 IEEE 电子系统热与热机械现象学会议 (ITherm)
会议时间:2024.5.28-2024.5.31
会议地点:科罗拉多州丹佛市盖洛德落基山脉度假酒店及会议中心
会议官网: https://www.ieee-itherm.net/
会议委员会
LEADERSHIP TEAM
General Chair
Ahish Gupta
Intel Corporation
Program Chair
Amy Marconnet
Purdue University
Vice Program Chair
Milnes David
IBM Corporation
Communication Chair
Jack Maddox
University of Kentucky
COMPONENT-LEVEL THERMAL MANAGEMENT
Track Chair
Luca Amalfi
SEGUENTE, Inc.
Track Co-Chair
Stephanie Allard
IBM Corporation
Track Co-Chair
Prabhakar Subrahmanyam
Intel Corporation
Track Co-Chair
Darin Sharar
Army Research Labs
SYSTEM-LEVEL THERMAL MANAGEMENT
Track Chair
Amir Shooshtari
University of Maryland
Track Co-Chair
Patrick Shamberger
Texas A&M University
Track Co-Chair
Sanjoy Saha
Intel Corporation
Track Co-Chair
Shadi Mahjoob
California State University, Northridge
MECHANICS AND RELIABILITY
Track Chair
David Huitnik
University of Arkansas
Track Co-Chair
Paul Paret
NREL
Track Co-Chair
Lang Yuan
EMERGING TECHNOLOGIES AND FUNDAMENTALS
Track Chair
Jimil Shah
TMG Core
Track Co-Chair
Sukwon Choi
Penn State
Track Co-Chair
Weihua Tang
Track Co-Chair
Saket Karajgikar
Meta
SPECIAL TECHNICAL CONTRIBUTIONS
Panel Chair
Victor Chiriac
Global Technology Cooling Group
Panel Co-Chair
Kimberly Saviers
Raytheon Technologies
Research Center
Panel Co-Chair
Vaibhav Bahadur (VB)
UT Austin
Tech Talk Chair
Naveenan Thiagarajan
GE
Tech Talk Co-Chair
Georges Pavlidis
University of Connecticut
Tech Talk Co-Chair
Qian Han
Student Poster Chair
Arjang Shahriari
Student Poster Co-Chair
Joseph Hanson
Intel
Student Poster Co-Chair
Aakrati Jain
IBM
Research Workshop Chair
Patrick Shamberger
Texas A&M University
Research Workshop Co-Chair
Sreekant Narumanchi
NREL
Research Workshop Co-Chair
Satish Kumar
Heat Sink Competition Co-Chair
Joe Alexandersen
University of Southern Denmark
Heat Sink Competition Co-Chair
Sameer Rao
University of Utah
Heat Sink Competition Co-Chair
Amy Marconnet
Purdue University
Heat Sink Competition Co-Chair
Naveenan Thiagarajan
GE
Heat Sink Competition Co-Chair
Ronald Warzoha
US Naval Academy
Heat Sink Competition Co-Chair
Jack Maddox
University of Kentucky
Keynotes Chair
John Thome
EPFL
Keynotes Co-Chair
Justin Weibel
Purdue University
NSF Interaction Chair
Mahsa Ebrahim
Loyola Marymount University
ITherm/ECTC Diversity Panel Representative
Cristina Amon
University of Toronto
PDC Chair
Jeffrey Suhling
Auburn University
PDC Co-Chair
Kitty Pearsall
IBM (Retired)
ADMINISTRATIVE
Finance Chair
Pritish Parida
IBM Corporation
Finance Co-Chair
Gargi Kailkhura
Lunar Energy
Operations Chair
Yuanchen Hu
IBM Corporation
Operations Co-Chair
Pardeep Shahi
Nvidia
SPONSORS AND EXHIBITORS
Sponsorship and Exhibitor Co-Chair
Mehdi Asheghi
Stanford University
Sponsorship and Exhibitor Co-Chair
Chandra Mohan (CM) Jha
Microsoft
Sponsorship and Exhibitor Co-Chair
Ronald Warzoha
US Naval Academy
COMMUNICATION
Conference Proceedings
Paul Wesling
Consultant
Social Media
Chirag Kharangate
Case Western Reserve University
Branding and Graphic Design
Jack Maddox
University of Kentucky
AWARDS
Richard Chu Award Chair
Sushil Bhavnani
Auburn University
Richard Chu Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Richard Chu Award Co-Chair
Yogendra K. Joshi
Georgia Institute of Technology
Best Paper Award Chair
Yogendra K. Joshi
Georgia Institute of Technology
Best Paper Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Best Paper Award Co-Chair
Jeffery Suhling
Auburn University
联系我们
Ashish Gupta 博士,总主席,general-chair@ ieee-itherm.net
Amy Marconnet 教授,项目主席,program -chair @ieee-itherm.net
Milnes P. David 博士,副主席项目主席,viceprogram-chair@ieee -itherm.net
John F. Maddox 教授,通讯主席,communications@ieee-itherm.net
2025.05.16 - 2025.05.18 越南 胡志明市
2025.04.02 - 2025.04.04 日本 横滨
2025.06.05 - 2025.06.07 泰国 曼谷
2025.04.07 - 2025.04.09 中国 海口
2024.11.20 - 2024.11.22
意大利 西西里岛
投稿截止 2024.09.15
2024.12.07 - 2024.12.09
越南 岘港
投稿截止 2024.09.30
2024.12.13 - 2024.12.15
马来西亚 吉隆坡
投稿截止 2024.09.20
2024.12.06 - 2024.12.08
中国 北京
投稿截止 2024.09.20