第十八届IEEE国际固态和集成电路技术会议（ICSICT 2026）

2026 IEEE 第十八届国际固态和集成电路技术会议（2026 IEEE 18th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2026），定于2026年10 月27日至30日在杭州举办，会议范围涵盖固态数字集成电路与系统级设计、模拟电路、器件、工艺技术及相关研究等全领域议题。

会议组委会
Life Honorary Chair
Yangyuan Wang, Peking University, China

Advisory Committee Co-Chairs
Ting-Ao Tang, Fudan University, China
Cor Claeys, Proximus, Belgium
Mengqi Zhou, IEEE China Council, China

General Chairs
Jan Van der Spiegel, University of Pennsylvania, USA
Bin Zhao, IEEE EDS, USA
Francois Rivet, University of Bordeaux, France
Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs
Ning Xu, Wuhan University of Technology, China
Cheng Zhuo, Zhejiang University, China
Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs
Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs
Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Yuchao Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair
Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Jing Jin, Shanghai Jiao Tong University, China
Yuchao Yang, Peking University, China

Subcommittee Co-Chairs
Hailong Jiao, Peking University, China
Zheng Wang, University of Electronic Science and Technology of China, China
Jin Wei, Peking University, China
Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Competition Chairs
Ying Wang, Institute of Computing Technology, CAS, China
Xiangyu Mao, University of Electronic Science and Technology of China, China
Hanru Shao, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Special Session Chairs
Haimeng Huang, University of Electronic Science and Technology of China, China
Kechao Tang, Peking University, China

Tutorial Chairs
Wei Mao, Xidian University, China
Hua Fan, University of Electronic Science and Technology of China, China

Regional Chair
Lobna Said, Nile University, Egypt

Industry Liaison Chairs
Liguang Chen, Shanghai Anlogic Infotech Co., Ltd., China
Sylvain Eimer, Truth Equipment, China
Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair
Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs
Lobna A. Said, Nile University, Egypt
Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer
Jianhong Zhou, Xihua University, China

Secretary General
Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

会议技术委员会
Theme 1: Digital & System Level IC
Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems
Chair: 
Zhiyi Yu, Sun Yat-sen University, China
Co-Chairs: 
Yaoyu Tao, Peking University, China
Hongyang Jia, Tsinghua University, China
Track 2: Digital Circuits
Chair: 
Yongpan Liu, Tsinghua University, China
Co-Chairs: 
Yanan Sun, Shanghai Jiao Tong University, China
Fengbin Tu, Hong Kong University of Science and Technology, China
Track 3: Design Methodology & EDA
Chair:
Jun Yang, Southeast University, China
Co-Chairs:
Yibo Lin, Peking University, China
Yu Li, Zhejiang University, China

Theme 2: Analog
Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair:
Keping Wang, Tianjin University, China
Co-Chairs:
Jian Pang, Shanghai Jiao Tong University, China
Kai Tang, Hunan University, China
Track 5: Wireline
Chair: 
Xiaoyan Gui, Xi'an Jiaotong University, China
Co-Chairs: 
Bingyi Ye, East China Normal University, China
Yuekang Guo, Shanghai Jiao Tong University, China
Track 6: General Analog
Chair: 
Lin Cheng, University of Science and Technology of China, China
Co-Chairs: 
Junmin Jiang, Southern University of Science and Technology, China
Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices
Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7: CMOS Logic Devices & Sensors
Chair:
Heng Wu, Peking University, China
Co-Chairs:
Wang Kang, Beihang University, China
Xiaosheng Zhang, University of Electronic Science and Technology of China, China
Track 8: Power Devices & Power IC
Chair:
Long Zhang, Southeast University, China
Co-Chairs:
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Zekun Zhou, University of Electronic Science and Technology of China, China
Track 9: Device Reliability & Security
Chair:
Mengyuan Hua, Southern University of Science and Technology, China
Co-Chairs:
Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China
Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies
Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10: Semiconductor Process Technologies
Chair:
Bobo Tian, East China Normal University, China
Co-Chairs:
Min Liao, Xidian University, China
Li Zhu, Nanjing University of Posts and Telecommunications, China
Track 11: Optoelectronics and Silicon Photonics Integration
Chair:
Linfeng Sun, Beijing Institute of Technology, China
Co-Chairs:
Ming Xu, Huazhong University of Science and Technology, China
Yuanfang Yu, Nanjing University of Posts and Telecommunications, China
Track 12: Packaging Technologies
Chair:
Jun Zhang, Nanjing University of Posts and Telecommunications, China
Co-Chairs:
Shenyang Mo, NARI Semiconductor R&D Center, China
Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

特别分会
Special Session 1: Ferroelectric Materials and Devices
Organizers: Prof. Kechao Tang (Peking University), Prof. Xiao Yu (Xidian University)

Special Session 2: Oxide Semiconductor Devices
Organizers: Dr. Mengwei Si (Shanghai Jiao Tong University), Dr. Sunbin Deng (Huazhong University of Science and Technology)

Special Session 3: Advanced Memory and Computing-In-Memory Circuit Design
Organizers: Assoc.Prof. Chaoyue Zheng (UESTC Yangtze Delta Region Institute), Dr. Yue Zhao (Hefei Normal University)

Special Session 4: Chiplet-based Integrated Systems
Organizers:Prof. Xiaohang Wang (Zhejiang University), Assoc. Prof. Letian Huang (UESTC Yangtze Delta Region Institute)

大会报告嘉宾
Jianjun Luo, Hangzhou Dianzi University, China
大会报告: Non-Volatile Memory Technology & Application Trends in Industry

Mohamad Sawan, Westlake University, China

Paul Penzes, Qualcomm Technologies, USA
大会报告: Engineering the Future: How AI Is Transforming Hardware Design

Wai Tung Ng, University of Toronto, Canada
大会报告: 3D Hetero-Integration of WBG Power Modules with Silicon-based Smart Power ICs

Zewen Liu, Tsinghua University, China
大会报告: GaN-MEMS Sensor and Its Application