会议日期
2024.04.22 - 2024.04.24
地点
美国 亚利桑那州,坦佩
投稿截止
2024.03.05
邮箱
电话
2024年IEEE第42届VLSI测试研讨会(VTS 2024)
2024年4月22-24日
美国,亚利桑那州,坦佩
https://tttc-vts.org/public_html/new/2024/
该会议包括主题演讲、科学论文演示、简短的工业应用论文演示、特别会议和创新实践会议。
General Chairs:
Sule Ozev
Arizona State University
Email: SuleOzev@asu.edu
Mehdi Tahoori
Karlsruhe Institute of Technology
Email: mehdi.tahoori@kit.edu
Program Chairs:
Naghmeh Karimi
University of Maryland, Baltimore County
Email: naghmeh.karimi@umbc.edu
Jennifer Dworak
Southern Methodist University
Email: jdworak@mail.smu.edu
征稿主题:
Analog – Mixed-Signal – RF Test
ATPG & Compression
Silicon Debug
Automotive Test & Safety
Built-In Self-Test (BIST)
Defect & Current Based Test
Defect & Fault Tolerance
Delay & Performance Test
Design for Testability – Yield or Reliability
Pre-silicon Design Verification & Validation
Post-silicon Validation
Hardware Security
Embedded System & Board Test
Embedded Test Methods
Emerging Technologies Test and Reliability
Fault Modeling and Simulation
Low-Power IC Test
Functional safety and test methods to ensure functional safety
Machine Learning in Test – Yield and Reliability
Microsystems/MEMS/Sensors Test
Memory Test and Repair
2.5D – 3D & SiP Test
Yield Optimization
On-Line Test & Error Correction
Power & Thermal Issues in Test
System-on-Chip (SOC) Test
Test & Reliability of Biomedical Devices
Test & Reliability of High-Speed I/O
Test & Reliability of Machine Learning Systems
Test Quality & Reliability
Test Standards & Economics
Test Resource Partitioning
Transient & Soft Errors
FPGA Test
2024年IEEE第42届VLSI测试研讨会(VTS 2024)
2024年4月22-24日
美国,亚利桑那州,坦佩
https://tttc-vts.org/public_html/new/2024/
该会议包括主题演讲、科学论文演示、简短的工业应用论文演示、特别会议和创新实践会议。
General Chairs:
Sule Ozev
Arizona State University
Email: SuleOzev@asu.edu
Mehdi Tahoori
Karlsruhe Institute of Technology
Email: mehdi.tahoori@kit.edu
Program Chairs:
Naghmeh Karimi
University of Maryland, Baltimore County
Email: naghmeh.karimi@umbc.edu
Jennifer Dworak
Southern Methodist University
Email: jdworak@mail.smu.edu
征稿主题:
Analog – Mixed-Signal – RF Test
ATPG & Compression
Silicon Debug
Automotive Test & Safety
Built-In Self-Test (BIST)
Defect & Current Based Test
Defect & Fault Tolerance
Delay & Performance Test
Design for Testability – Yield or Reliability
Pre-silicon Design Verification & Validation
Post-silicon Validation
Hardware Security
Embedded System & Board Test
Embedded Test Methods
Emerging Technologies Test and Reliability
Fault Modeling and Simulation
Low-Power IC Test
Functional safety and test methods to ensure functional safety
Machine Learning in Test – Yield and Reliability
Microsystems/MEMS/Sensors Test
Memory Test and Repair
2.5D – 3D & SiP Test
Yield Optimization
On-Line Test & Error Correction
Power & Thermal Issues in Test
System-on-Chip (SOC) Test
Test & Reliability of Biomedical Devices
Test & Reliability of High-Speed I/O
Test & Reliability of Machine Learning Systems
Test Quality & Reliability
Test Standards & Economics
Test Resource Partitioning
Transient & Soft Errors
FPGA Test
2024.11.08 - 2024.11.10 中国 南京
2025.07.15 - 2025.07.17 中国 内蒙古呼和浩特
2025.05.20 - 2025.05.22 泰国 曼谷
2025.05.20 - 2025.05.22 泰国 曼谷
2024.11.20 - 2024.11.22
意大利 西西里岛
投稿截止 2024.09.15
2024.12.07 - 2024.12.09
越南 岘港
投稿截止 2024.09.30
2024.12.13 - 2024.12.15
马来西亚 吉隆坡
投稿截止 2024.09.20
2024.12.06 - 2024.12.08
中国 北京
投稿截止 2024.09.20