2025年IEEE集成电路技术与应用国际会议 (ICTA 2025)

【主办单位】

IEEE

MTT-S Nanjing

BIE

【赞助单位】

EDS Beijing Chapter

SSCS Guangzhou Chapter

CAS

【支持单位】

CHINA ASSOCIATION FOR SCIENCE AND TECHNOLOGY

University of Macau

【会议组委会】

【Conference Committee】

- Honorary Chair -

Rui Martins, U. Macau, China

- General Co-Chairs -

Pui-In Mak, U. Macau, China

Sai-Weng Sin, U. Macau, China

- TPC Co-Chairs -

Bo Zhao, ZJU, China

Yan Lu, Tsinghua, China

- Steering Committee Members -

Lin Cheng (Chair), USTC, China

Xiaoyan Gui, XJTU, China

Zhiyi Yu , Sun Yat-sen U., China

Dixian Zhao, Southeast U., China

Liyuan Liu, IS-CAS, China

Fujiang Lin, USTC, China

Zhihua Wang, Tsinghua, China

Nanjian Wu, IS-CAS, China

- International Advisors -

Jan Van der Spiegel, IEEE SSCS, USA

Ke Wu, IEEE MTT-S, Canada

Yong Lian, IEEE CASS, USA

Geok Ing Ng, IEEE EDS, Singapore

Giovanni Demicheli, EPFL, Switzerland

Yann Deval, U. Bordeaux, France

R. Bogdan Staszewski, UCD, Ireland

Boon S. Ooi, KAUST, Saudi Arabia

Hoi-Jun Yoo, KAIST, Korea

Makoto Ikeda, U. of Tokyo. Japan

Patrick Yue, HKUST, China

- Local Arrangement Chair -

Chi-Hang Chan, U. Macau, China

- Tutorial Chair -

Yang Jiang, U. Macau, China

- Keynote Speakers Chair -

Mo Huang, U. Macau, China

- Industry Papers Chair -

Jiawei Xu, U. Macau, China

- Publication Chair -

Haijun Shao, U. Macau, China

- Sponsorship/Exhibition Chair -

Mingqiang Guo, U. Macau, China

- Awards Committee Chair -

Zheng Wang, UESTC, China

- Website Chair -

Ying Zhang, BJAST, China

【会议征稿】

1.RF Circuits and Wireless Systems: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.

2.Analog and Mixed-Signal ICs: analog circuits including amplifiers, comparators, oscillators, filters, references, nonlinear analog circuits and digitally-assisted analog circuits; data converters including Nyquist-rate and oversampling ADC and DAC, etc.

3.Power-management ICs: Power management and control circuits; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; linear regulators; gate drivers; topologies for wide-bandgap devices; power and signal isolators; LED drivers, wireless power, and envelope supply modulators; energy harvesting circuits and systems.

4.Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.

5.Wireline ICs: high-speed data link, optical transceiver, OEIC, SerDes, TIA, CDRs, equalizer, modulator, etc.

6.Modeling, EDA and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, EDA, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.

7.Device and Process Technologies: CMOS, FinFET, FD-SOI, BCD, SiGe, III-V, HEMT, HBT, 3rd generation materials, GaN, power electronics, SiC, GaO, junctionless device, negative capacitance device, MEMS, device characterization, device FAR, 3D integration, Chiplet, flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.

8.Packaging and Hybrid Integration: Chiplet, active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D integration, etc.

9.Sensors and Applications: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc

10.System and Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.

11.Emerging Technologies and Applications: heterogeneous integration, III-V compounds, silicon photonics, optoelectronic device, 2D materials, green and implantable materials, neuromorphic device, device characterization, etc.

12.Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.

【投稿指南】

为鼓励及时报告最新成果，并有更好的机会扩充论文以便在期刊上发表，请有意投稿的作者以 IEEE Xplore PDF 格式提交 2 页的英文论文（包括初次投稿和最终版本（如被录用））。论文应强调原创性贡献和主要发现，包括数字、图表和通过直接或间接测量验证的模拟结果。鼓励提供最多 2 页的附加图表，以支持初次提交的论文，但这些图表将不会在最终出版物中出现。参考文献应清晰引用，并保持最新。特邀论文可长达 6 页。

投稿链接：icta2025

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